MacDermid Alpha Electronics Solutions, a global provider of integrated solutions from our circuit, assembly and semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, has successfully implemented an efficient 5G heat management solution in China. Electrolube, part of MacDermid Alpha Electronics Solutions, has faced a complex heat management challenge to design a base station that can offer high thermal conductivity and long-term reliability.
5G base stations rely on advanced antenna technology in the form of massive MIMO antennas that send and receive more data simultaneously in a wider mobile spectrum called mmWave frequencies. Although called “massive”, these antennas are similar in size to 4G antennas. In this way, 5G technology offers increased efficiency without increasing physical size; a continuing trend in the electronics industry, which is closely linked to the rapid increase in the efficient use of heat management materials. Although there is an increase in energy efficiency for data transmission, the energy consumption of 5G base stations is much higher than that of 4G stations, which again emphasizes the need for efficient heat dissipation to avoid overheating. Thermal control is a critical element of the reliability and performance of 5G and heat dissipation requirements must be taken into account at the design stage.
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Electrolube’s GF400 gap filler has been found to be an extremely successful thermal interface for reducing heat in the versatile design of the 5G base station module. The GF400 is a material that is designed for use with thicker than the standard thermal interface material. It provides excellent thermal conductivity, but also retains its stability at these higher thicknesses, ensuring efficient and reliable heat transfer. Baseband is a critical part of signal processing in the baseband, increasing capacity and reducing latency. At high temperatures, electromigration also occurs at a faster speed, noise is more intense, built-in antennas emit less at desired frequencies, and many other problems occur in 5G systems. Solutions to these challenges need to be addressed at board level and through the use of heat management solutions.
Electrolube’s GF400 is a two-component liquid silicone void filler that provides excellent thermal performance (4.0 W / mK). With a wide operating temperature range between -50 to + 200 ° C and non-flammable, the GF400 is an indispensable material that can be used to help dissipate heat from complex geometries. After curing, it forms a low modulus elastomer that can also relieve CTE stress during a power cycle. The GF400’s features make it one of the most efficient heat management products for heat dissipation management in data applications and telecommunications networks. The advantages of the GF400 have shown a lower coefficient of expansion, lower modulus, better long-term reliability and improved cost-effectiveness, pushing it to the forefront of thermal management proposals for the connected world.
MacDermid Alpha Electronics Solutions allows the interconnection of electronics through innovative specialty chemicals and materials from our brands Alpha, Compugraphics, Electrolube, Kester and MacDermid Enthone. We serve all global regions and all stages of the production of devices in each segment of the electronics supply chain. Experts in our departments of semiconductor solutions, circuit solutions and assembly solutions work with OEMs and manufacturers to implement new technologies that redefine what is possible in device design. Our world-class maintenance is constantly at hand to ensure optimized results in terms of yield and productivity. Our solutions can increase productivity, reduce carbon footprint, lower total cost of ownership and enable innovation in electronics.
For more information, please visit www.electrolube.com.
