NXP’s FEIC enables Wi-Fi 6 connectivity in the Honor Magic V smartphone – Electronics World

NXP Semiconductors’ WLAN7207H 2.4GHz front-end integrated circuit (FEIC) is at the heart of Wi-Fi 6 connectivity in Honor’s flagship Magic V smartphone. The NXP WLAN7207x single FEM family provides routing and PCB design flexibility that optimizes RF performance in the smartphone.

“As smartphones have become more feature-rich, the form factor has become a distinguishing feature for consumers,” said George Zhao, CEO of Honor. “NXP’s FEM solution has allowed us to overcome the increasing complexity and design challenges presented by our flagship phones, while offering the longer transmission range and improved signal quality that consumers associate with Wi-Fi 6.”

To meet consumer needs, smartphones are becoming increasingly complex, creating challenges for PCB architectures and designs. At the same time, users don’t want to compromise on Bluetooth and Wi-Fi 6 performance, which deliver a number of improvements over previous generations, including reduced latency and increased network capacity and efficiency. The WLAN7207x single FEM family offers designers more freedom in PCB routing and placement, enabling RF optimization that supports higher Wi-Fi 6 and Bluetooth performance.

“As consumers continue to rely on their smartphones for an ever-growing list of data-driven benefits, Wi-Fi 6 addresses the need to move a rapidly growing amount of data between more devices,” said Doeko Terpstra, vice president and general manager of Solutions for smart antenna, NXP. “Our FEIC solutions enable the performance benefits of Wi-Fi 6 that consumers desire while offering the design flexibility that OEMs need.”