Supply chain crisis: When will the chip shortage end? What is the solution? Supply chain problems are prevalent, leading to supply disruptions and production cuts, shortages of arrears and loss of profits. Then there is offshore production, which poses a threat to security as democracy is threatened around the world. The National Defense Authorization Act of 2021 (NDAA) calls for action to turn American innovation into locally produced, market-ready technology to provide solutions to current market threats.
Join us for technical presentations that provide insights into real risk and solutions that meet the NDAA’s 2021 mission and strengthen the US position in electronics research, development and manufacturing.
Advances in the production of additives with different materials – Aaron Sutter, Nano Dimension
This presentation discusses the advances in the technology for the production of additives from various materials applied to electronic circuits and the advantages of the supply chain. Additive manufacturing provides rapid prototyping and on-site production, is environmentally friendly and provides designers with new ways to produce electronics. On-site production capabilities mean that supply chain infrastructure can be more efficient, shorten cycle times and reduce the risk of supplying parts.
Nanoelectronics on Demand – Ahmed Busnaina, Center for High Speed Nanoproduction
The cost of building an economically viable plant has reached $ 20 billion per plant recently. The energy intensity of the current semiconductor production processes is extremely high. Huge amounts of highly corrosive and toxic materials, water and energy used in the production of semiconductors impose an unsustainable burden on the environment. Nanoscale additive manufacturing can be realized as a single line of tools for printing integrated circuits at significantly lower cost, higher productivity and significantly lower environmental impact. This platform has the potential to change the landscape of electronics manufacturing to make it material-independent and able to print many materials on demand.
Thermal reliability of accumulating layers of hydrocarbon dielectrics – Paul Cook, AGC
In the last few years, there have been concerns about products that require high reliability when using micro-structures. As a result, many manufacturers require the rejection of very complex designs with a large number of layers. This has led to very conservative rules for designers to use and meet the capabilities of manufacturers. This study shows how a thin hydrocarbon dielectric layer can be used and optimized for stacked micro-holes that demonstrate solid thermal reliability of up to 5 HDI layers on both sides, also shows that there seems to be no ceiling indication of how many layers can be used.
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