The company also adds deep trench insulation to its 180nm BCD platform, allowing up to a 40% reduction in matrix size for voltages up to 125V.

The upgrades focus on the growing demand for higher-power integrated circuits with higher voltage and energy efficiency, further improving Tower’s leading market position in support of the electric IC market, which according to Yole Développement (Yole) will reach over 25 , $ 5 billion by 2026

The updated 65nm BCD takes advantage of power and / or reduction in matrix size by up to 20% due to the reduction of LDMOS Rdson for devices up to 16V along with expanding the voltage up to 24V operation.

This meets the needs of computer and consumer markets for high-power monolithic converters, including a high-power voltage regulator for CPUs and GPUs in addition to applications such as chargers, high-power motor drivers and power converters.

The 180nm BCD Deep Trench Insulation Circuit (DTI) offers improved noise immunity within one IC, flexibility at increased voltages, allowing a choice between multiple insulation schemes and a reduced matrix size of up to 40%.

All these strategic features support the growing market penetration of 48V systems that require ICs to maintain voltages up to 120V and above; and specifically meet the advancing requirements of industrial and automotive applications, including gate drivers, power converters, motors and automotive 48V systems with their demand for advanced insulation in ICs with multiple voltage domains at a smaller matrix size.

Tower upgrades BCD processes

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