MediaTek has finally pulled back the curtains on its long-awaited Dimensity 9300+ chipset. The company announced that the new processor will be unveiled on May 7 at its developer conference. Although the silicon giant did not mention any details about the processor, it is expected to offer higher specifications compared to the standard Dimensity 9300 SoC. It is also expected to include AI capabilities, given that the event itself is AI-centric. Notably, the Vivo X100s is rumored to launch soon with the MediaTek Dimensity 9300+.
The announcement was made on Weibo post (through GSMArena), where the company also listed details of the MediaTek Dimensity Developer Conference (MDDC) 2024. The MediaTek Dimensity 9300+ chipset will be unveiled during the event next Tuesday. He also teased “more surprises” for the event, but didn’t reveal what they might be. Notably, the company chose the hashtag “#AIeverything” for the event.
While details of the chipset are not known from official sources, earlier leakage from a Weibo tipster (through innoGyan) offered some of its specifications. According to the tipster, the processor will be equipped with an upgraded Cortex-X4 core clocked at 3.4 GHz as opposed to the 3.25 GHz of the standard Dimensity 9300.
The MediaTek Dimensity 9300+ is also tipped to feature an AI Processing Unit or APU. Although no details are known, it is believed to be a modified Neural Processing Unit (NPU), which is commonly used for artificial intelligence calculations. The chipset is expected to power the device’s processing for AI features created by smartphone brands and Android developers.
According to an earlier report, the Vivo X100s could be one of the first smartphones equipped with the new chipset. Part of the Vivo X100 series, the upcoming phone is expected to be launched soon alongside the Vivo X100s Pro and Vivo X100 Ultra. The X100s may feature a Zeiss-branded ring-shaped rear camera island with a flat bezel. In addition, the rear panel may receive a textured finish.
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